Cyient DLM signs MoU with Hindustan Shipyard

To explore opportunities to collaborate for maritime and defence electronics solutions

Cyient DLM and Hindustan Shipyard have signed a Memorandum of Understanding (MoU) to explore opportunities for collaboration in advanced electronics and technology solutions for maritime and defence applications.

The MoU brings together HSL's experience in shipbuilding, ship repair and platform integration with Cyient DLM's capabilities in mission-critical electronics, embedded systems, power electronics, precision manufacturing, testing and product lifecycle support. The collaboration will explore areas that can contribute to greater indigenization and technology development in support of the Government of India's Atmanirbhar Bharat objectives.

Under the framework, the two organizations will evaluate potential areas of cooperation across electronics, embedded systems, power electronics, testing, manufacturing and lifecycle support for maritime and defence applications. The companies will also explore opportunities in areas such as indigenization, obsolescence management, test and support systems, autonomous and unmanned maritime platforms, power electronics and AI-enabled maintenance solutions.