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Board of Mold-Tek Packaging approves bonus issue of 1:1

26-Aug-2026 | 16:26
At meeting held on 26 August 2026

The board of Mold-Tek Packaging at its meeting held on 26 August 2026 has approved issue of bonus shares in ratio of 1:1. The board also approved increase in authorised share capital from Rs 20 crore to Rs 40 crore dividend into 8 crore equity shares of Rs 5 each.